Low Viscosity Casting Resin
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Low Viscosity Casting Resin

Low Viscosity Casting Resin is a versatile, engineered liquid polymer system designed primarily for potting, encapsulation, and casting applications where intricate detail capture and void-free filling are paramount. Typically based on epoxy chemistry, this resin is the product of scientific formulation that incorporates specific reactive diluents and employs advanced polymerization control to precisely tailor its viscosity to a low, easily pourable state.
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Product Introduction

Introduction

 

This is a low-viscosity modified epoxy resin, primarily used for bubble-free potting and insulation protection of precision electronic components.

 

161AB-25

 

Products Features

 

1. Excellent Fluidity

Viscosity as low as 330~390 mPa·s at 40℃, automatically filling tiny gaps.

 

2. High Thermal Conductivity

Thermal conductivity up to 0.6 W/m·K, quickly dissipating component heat to prevent local overheating.

 

3. Insulation Performance

Minimal impurities after high-vacuum degassing, dielectric strength ≥26 MV/m, preventing component leakage.

 

 

Basic parameters of the product before mixing

 

Components

Main agent

Curing agent

Reference Standards

Color

transparent

light yellow

all

Viscosity 40℃ (mpa.s)

330~390

150~200

GB/T24148.4-2009

Density (g/mL))

1.15~1.20

1.10~1.20

GB/T6750-2007

Note: Customers can add fillers and adjust colors according to their product needs during use.

 

Process Control

 

1. Mold Preparation
Assemble the casting body, apply release agent, and cure in an oven at 80-100℃ for 5-8 hours.

 

2. Material Preheating
Mix materials at a 1:1 ratio (A:B), place in an oven preheated to 70℃, and hold for 2-3 hours.

 

3. Casting Tank Setup
Transfer the cured casting body to the casting tank (70-75℃). Add preheated A/B materials and fillers per formula ratio, then reduce tank temperature to 60℃.

 

4. Mixing & Degassing
Stir materials in the mixing tank at 60℃ for 90 minutes. Evacuate to 50-150Pa until fully degassed (confirmed via sight glass).

 

5. Casting & Post-Processing
Pour within 30-70 minutes (based on casting body size). Maintain vacuum for 30-40 minutes post-pour, then apply 2 kg pressure before removal.

 

Curing Temperature Profile

 

Stage

Content

Curing time (min)

Curing temperature (°C)

1

heating

30

25~80

2

constant temperature

360

80

3

heating

15

80~100

4

constant temperature

240

100

5

heating

15

100~130

6

constant temperature

360

130

Note: The curing temperature profile can be adjusted appropriately according to different product characteristics and requirements without affecting product performance.

 

Product Characteristics After Curing

 

Testing items

Low viscosity casting resin

Reference Standards

Tensile strength(MPa)

92~103

GB/T 15022.2-2017

Tensile modulus of elasticity (MPa)

14.72~16.99*10³

Bending strength (MPa)

136~143

Flexural modulus (MPa)

12.25~13.36*10³

Impact strength (KJ/m²))

56~66

Elongation at break (%)

1.6~1.8

Compressive strength (MPa)

176~186

Hardness (Shored)

83~88

Volume resistivity (Ω·m)

1015

Electrical strength (MV/m)

26

 

4

Packaging & Storage

Insulation Class: F

Packaging Specifications: 1000KG or 220KG

Shelf Life and Storage Conditions:

Shelf life: 180 days. After the shelf life, the product must pass inspection before use. Store in a well-ventilated, dry place, away from moisture and fire.

 

customization

 

Filler Adjustment
Fillers can be added according to requirements to meet specific performance needs.

 

Color Customization
Colors can be adjusted during use to match product specifications.

 

Company Strengths

 

1. Strict Quality Control
From raw material inspection to finished product release, every batch is tested for viscosity, density, and electrical properties to ensure data stability.

 

2. Technical Support
Provides detailed process parameter guidance, including preheating, vacuum degree, and curing temperature, to help customers get started quickly.

 

3. Stable Supply Chain
Sufficient raw material reserves and flexible production scheduling effectively guarantee delivery times for customers.

 

 

Applications

Electronics Protection
Used for potting PCBs, sensors, and control modules to enhance insulation and environmental resistance.

Power Modules
Suitable for encapsulating high-power electrical devices to ensure stable operation.

Small Transformers & Coils
For filling and securing miniature transformers, inductors, and coils.

Connectors & Junction Boxes
Provides sealing protection for various electrical connection components.

 

 

fAQ

 

Q1. How to handle bubbles in the product?
It is recommended to perform vacuum degassing at 70-75℃, with a vacuum degree of 50-150Pa, until the material is completely degassed.

 

Q2. How to set the curing temperature?
A step-wise heating curing process is recommended: first cure at 80℃, then at 100℃, and finally at 130℃.

 

Q3. What is the shelf life of the product?
Under dry, ventilated, and light-proof conditions, the shelf life is 180 days.

 

Q4. Can the color of the product be adjusted?
Yes. Fillers and colors can be added according to requirements during use.

 

Q5. How to handle skin contact?
If in contact with skin, wipe off with a soft cloth and wash with hand sanitizer; if in contact with eyes, rinse immediately with water and seek medical attention.

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