Cryogenic Epoxy
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Cryogenic Epoxy

Cryogenic Epoxy refers to a series of high-performance, room-temperature curing compounds specifically formulated to maintain their properties in low-temperature environments. These epoxy end-sealing and potting materials are characterized by a fast curing profile at ambient conditions, a viscosity that is moderately high to minimize runoff on vertical surfaces, broad applicability across various substrates, and user-friendly processing.
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Product Introduction

Introduction

 

Cryogenic Epoxy is a high-performance, room-temperature curing epoxy resin designed for potting and end-sealing electronic components in cryogenic environments.

 

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Products Features

 

1. Cryogenic Impact Resistance
Maintains structural integrity and reliable sealing in liquid nitrogen environments as low as -196°C.

 

2. Non-Sag Viscosity
With a viscosity of 3400~4000 mPa·s at 40°C, it fills gaps effectively while preventing runoff on vertical surfaces.

 

3. Rapid Room-Temperature Cure
Gels in 2-3 hours and fully cures in 18-24 hours at 25°C, with a pot life of 30-40 minutes, requiring no external heat.

 

Basic parameters of the product before mixing

 

Components

Main agent

Curing agent

Reference Standards

Color

bright red

Pale yellow or dark brown

all

Viscosity 40℃ (mpa.s)

3400~4000

122~132

GB/T24148.4-2009

Density (g/mL))

1.66~1.69

1.10~1.15

GB/T6750-2007

Note: Main component can be customized.

 

Process Instruction

 

Surface Preparation
Thoroughly clean the surface of the object to be potted.

 

Component A Preparation
Pre-stir component A completely before use.

 

Mixing
Strictly adhere to the A:B ratio of 4:1. Mix components A and B thoroughly in the mixer.

 

Pot Life
30-40 minutes at 25℃ (100g mixture). Complete potting within 40 minutes to ensure optimal flowability.

 

Curing
At 25℃ with a 5mm thickness, the compound gels in 2-3 hours and fully cures in 18-24 hours. Curing time varies with ambient temperature, object size, and thickness.

 

Product Characteristics After Curing

 

Testing items

Low temperature epoxy resin

Reference Standards

Tensile strength(MPa)

64~68

GB/T 15022.2-2017

Tensile modulus of elasticity (MPa)

9.96~10.83*10³

GB/T 15022.2-2017

Bending strength (MPa)

113~120

Flexural modulus (MPa)

8.93~9.96*10³

Impact strength (KJ/m²))

16~23

Compressive strength (MPa)

151~157

Hardness (Shored)

82~88

Volume resistivity (Ω·m)

1014

Surface resistivity (Ω·m)

1014

Electrical strength (MV/m)

28

 

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Packaging & Storage

Main Agent: 24 KG, Hardener: 6 KG

Shelf Life and Storage Conditions:

Shelf life: 180 days. After the shelf life, the product must pass inspection before use. Store in a well-ventilated, dry place away from fire.

 

Customization

 

1. Viscosity Adjustment
Adjust product viscosity to meet the requirements of different dispensing equipment.

 

2. Functional Fillers
Customize thermal or electrical conductivity by modifying filler content.

 

3. Color Customization
Provide various color options for easy product identification.

 

Company Strengths

 

1. In-house R&D Lab
Equipped with professional testing instruments and pilot production lines, enabling rapid formula validation and performance testing.

 

2. Large-scale Production Capacity
Operates multiple automated production lines with a monthly capacity of 500 tons, capable of stably handling large-volume orders.

 

3. End-to-end Quality Control
Every batch undergoes full testing of viscosity, density, electrical properties, and other key indicators from raw material intake to finished product shipment.

 

Applications

Cryogenic Electronics Protection
Used for potting PCBs, sensors, and control modules operating in liquid nitrogen or oxygen environments.

Superconducting Equipment Encapsulation
Suitable for securing and insulating superconducting magnets, cryogenic probes, and related components.

Aerospace & Research Systems
For sealing electrical parts in space simulation chambers and cryogenic test platforms.

Cryogenic Connection Systems
Provides reliable protection for low-temperature cable joints and junction boxes.

 

 

FAQ

 

Q1. What is the mixing ratio and pot life?
Strictly adhere to the A:B ratio of 4:1. The pot life for a 100g mixture at 25°C is 30-40 minutes.

 

Q2. How long does it take to cure?
At 25°C, a 5mm thickness gels in 2-3 hours and fully cures in 18-24 hours.

 

Q3. How to handle skin contact?
If on skin, wipe with a soft cloth and wash with hand sanitizer. If in eyes, rinse immediately with water and seek medical attention.

 

Q4. What are the pre-mixing steps?
Thoroughly clean the surface. Pre-stir component A (main agent) before mixing with component B.

 

Q5. How to store the product?
Store in a cool, dry, and ventilated place away from direct sunlight. Keep containers tightly sealed when not in use.

 

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