Led Encapsulation Epoxy
Introduction
LED encapsulation epoxy is a highly transparent modified polymer engineered to protect LED chips and efficiently transmit light.
Products Features
1. High Light Transmittance
Cures into a low-scatter, refractive-index-matched transparent network for maximum LED light output.
2. Exceptional Weatherability
UV- and moisture-resistant molecular structure maintains clarity and integrity under prolonged outdoor exposure.
3. Impact Resistance
The cured matrix combines high hardness with toughness to absorb mechanical shocks and prevent chip damage or encapsulant cracking.
Basic parameters of the product before mixing
|
Components |
Main agent |
curing agent |
Reference Standards |
|
color |
transparent |
transparent |
all |
|
Viscosity 40℃ (mpa.s) |
280~360 |
78~85 |
GB/T24148.4-2009 |
|
Density (g/mL)) |
1.14~1.15 |
1.11~1.13 |
GB/T6750-2007 |
applications
Outdoor LED displays
Automotive headlights and signal lamps
High-brightness SMD LEDs
Industrial lighting modules
Consumer electronics backlight units
Processing Instructions
Clean Substrate
Ensure surface is free of oil, dust, and contaminants.
Pre-Stir Main Agent
Stir Part A thoroughly until homogeneous before use.
Accurate Mixing
Mix Parts A and B strictly at 2:1 by weight, then stir completely.
Timely Potting
Complete potting within 40 minutes after mixing to maintain flowability.
Standard Cure
Gel in 60 min and fully cure in 4–6 hrs at 25°C; extend time for large parts or lower temperatures.
Customization Options
We offer flexible customization to meet diverse encapsulation needs
Transmittance optimization (>92% @ 450nm)
Viscosity adjustment (280–1000 mPa·s @ 40°C)
Cure speed tuning (fast-cure / standard options)
Color options (water-clear, pale yellow, etc.)
Stress level control (low-stress formulation available)
Product Characteristics After Curing
|
Testing items |
ledEncapsulating epoxy resin |
Reference Standards |
|
Tensile strength(MPa) |
67~74 |
GB/T 15022.2-2017 |
|
Tensile modulus of elasticity (MPa) |
10.96~12.01*10³ |
GB/T 15022.2-2017 |
|
Bending strength (MPa) |
118~121 |
|
|
Flexural modulus (MPa) |
9.66~10.56*10³ |
|
|
Impact strength (KJ/m²)) |
19~26 |
|
|
Compressive strength (MPa) |
151~155 |
|
|
Hardness (Shored) |
81~85 |
|
|
Volume resistivity (Ω·m) |
1014 |
|
|
Surface resistivity (Ω·m) |
1014 |
|
|
Electrical strength (MV/m) |
28 |
Packaging Storage
Main Agent: 20 KG; Hardener: 10 KG / 5 KG
Shelf Life and Storage Conditions
Shelf life: 180 days. After the shelf life, the product must pass inspection before use. Store in a well-ventilated, dry place away from fire.
why choose us
Technical Support
End-to-end assistance-from material selection and process tuning to failure analysis.
Customization
Formulations and processing parameters tailored to specific customer requirements.
Reliable Supply
In-house production ensures fast delivery of standard grades and supports long-term inventory planning.
Quality Assurance
ISO-compliant quality system with full inspection of critical parameters for high batch-to-batch consistency.
FAQ
Q1: Does hot weather shorten working time?
Yes-every 10°C rise in ambient temperature reduces pot life by ~30%. Maintain workshop at 25±3°C.
Q2: Why is the surface tacky after curing?
Usually due to incomplete mixing, incorrect ratio, or high humidity. Review your mixing procedure.
Q3: Is it suitable for COB packaging?
Yes-it has balanced flow properties ideal for COB, SMD, and other common LED packaging formats.
Q4: Is vacuum degassing necessary?
Recommended-brief degassing (<5 min) after mixing significantly reduces bubbles and improves optical uniformity.
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