High Tg Epoxy Resin
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High Tg Epoxy Resin

Glass transition temperature (Tg) is the key parameter that determines the heat resistance rating and maximum operating temperature of epoxy resin materials. Our high Tg epoxy resin achieves a Tg above 160°C.
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Product Introduction

Superior Heat Resistance for High-Temperature Applications

Glass transition temperature (Tg) is the key parameter that determines the heat resistance rating and maximum operating temperature of epoxy resin materials. Our high Tg epoxy resin achieves a Tg above 160°C. It maintains excellent dimensional stability and electrical insulation performance under high-temperature conditions.

Proven Performance at High Operating Temperatures

For electrical equipment that needs long-term stable operation at high temperatures, high Tg means lower creep, more stable dielectric performance, and longer service life. Our high Tg epoxy resin has been used in batch production by multiple power equipment manufacturers in Guangxi and Guangdong for Class H heat resistance transformers and motors. Customer feedback shows that the dielectric strength retention rate exceeds 90% at high temperatures. We hold CMA and SGS third-party testing certification. Our complete R&D and production system allows us to customize Tg based on your specific temperature requirements. We provide free samples for testing.

product-808-1080

 

Technical Specifications with Flexible Customization

 

Our high Tg epoxy resin comes in 20kg and 200kg packaging. We ship as regular chemical products. Storage should be in a cool, dry, and dark place with sealed containers. The shelf life is 12 months. We customize Tg from 150°C to 180°C. We also adjust curing schedules and viscosity to match your production conditions. We optimize the formulation to maintain dielectric strength and volume resistivity retention at high temperatures. All custom products undergo aging testing verification.

 

Parameter

Value

Glass transition temperature (Tg)

≥160°C (customizable to 180°C)

Long-term working temperature

≥155°C

Short-term thermal shock resistance

≥200°C

Thermal decomposition temperature (5%)

≥350°C

Volume resistivity (155°C)

≥10¹¹ Ω·cm

Dielectric strength (room temperature)

≥22 kV/mm

Coefficient of thermal expansion (below Tg)

≤25 ppm/°C

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